High-Tg PCB

What is High Tg PCB?

Utilize this informative guide to categorize printed circuit boards based on their high heat resistance (Tg) and raw material composition. This is an essential resource for those seeking to understand the various temperature capabilities of PCBs.

    The product offers standard copper-clad laminate PCBs with a temperature range of 130-140°C. For higher temperature needs, consider the Middle Tg PCBs at over 150°C, or the High Tg PCBs at above 170°C. These are typically found in the range of 180-225°C.

The product offers a variety of materials, including rigid and flexible polyimide, all of which have an average Tg of 220°C. Some options, such as hydro-carbon ceramic-filled substrate, can withstand temperatures above 280°C, while Teflon-based laminates can sustain temperatures exceeding >300*C.

The high Tg PCB includes a resin system specifically created to endure lead-free soldering, offering increased mechanical strength in extreme, high-temperature conditions. Resin is a term for solid or semisolid organic materials frequently found in plastics and varnishes.

A higher Tg in PCBs indicates increased stability and resistance to heat, moisture, chemicals, and other factors that could otherwise inhibit effectiveness.

In recent years, more and more PCB customers are requesting to manufacture their projects with high Tg due to its resiliency, high mechanical strength, and ability to withstand harsh environments.

Advantages of High Tg PCB


For devices with high power density and significant heat generation, utilizing High Tg PCB is an effective solution for efficient heat management.


A larger PCB or a high Tg PCB board can reduce heat generation in a regular PCB, by changing its design or power requirements.

Optimal for Multilayer & HDI PCBs: Multilayer & HDI PCBs typically have compressed designs and intricate circuitry, leading to potential heat build-up. To ensure dependable performance, High Tg boards are frequently implemented in these types of PCBs.

H-Enhanced Stability: By increasing the Tg of a PCB substrate, the resulting device will exhibit improved levels of heat, moisture, and chemical resistance, thus enhancing overall stability.


Applications of High Temperature PCB: If the electronic product has a higher power density, using High Tg printed circuit boards may be the most effective solution to minimize heat generation and potential disturbance to other components. This solution can significantly reduce weight, cost, and power requirements while maintaining a smaller overall product size. Additionally, implementing high Tg printed circuit boards is a cost-effective and practical approach in addressing the damaging effects of high temperatures on the circuit board’s dielectrics and conducting elements, as well as mechanical stress caused by thermal strain variations. In extreme cases, these factors can result in permanent failure.

The product’s heat removal mechanism plays a critical role in the design of the printed circuit board. By limiting power density, the product’s features and market value can be preserved. However, adding more heat sinks may increase the weight, size, and cost of the PCB. Although designers are knowledgeable about various heat management methods, their choices will inevitably affect the printed circuit board’s performance.

In order to address these issues, it is recommended to utilize high Tg printed circuit boards for high temperature applications. For temperatures above the standard range (130-140C), materials with a Tg of >170C should be used, with common options being 170C, 175C, and 180C. Ideally, the Tg of the PCB should be at least 10-20C higher than the product’s operating temperature.